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  1999. 11. 25 1/4 semiconductor technical data kia7419p/f~kia7445p/f bipolar linear integrated circuit revision no : 2 voltage detector this ic series is usable for the cpu system of all types and wired logic system as it has the function of detecting the power supply voltage at the time of initial resetting after switching the power supply on and after instantaneous break in power supply voltage there-by accurately resetting the system this particular series has especially been designed as the high resetting output type. features h current consumption is low. i ccl =30  a typ. i cch =300  a typ. h resetting output minimum guarantee voltage is low 0.8v typ. h hysteresis voltage is provided 50mv typ. h reset signal generation starting voltages: kia7419p/f 1.9v typ. kia7433p/f 3.3v typ. kia7421p/f 2.1v typ. kia7434p/f 3.4v typ. kia7423p/f 2.3v typ. kia7435p/f 3.5v typ. kia7425p/f 2.5v typ. kia7436p/f 3.6v typ. kia7427p/f 2.7v typ. kia7439p/f 3.9v typ. kia7429p/f 2.9v typ. kia7442p/f 4.2v typ. kia7431p/f 3.1v typ. kia7445p/f 4.5v typ. kia7432p/f 3.2v typ. h taping type is also available. applications (1) as control circuit of battery-backed memory units. (2) as measure against erroneous operations at power supply on-off time. (3) as measure against system runaway at instantaneous break of power supply etc. (4) as resetting function for the cpu-mounted equipment, such as personal computers, printers, vtrs and so forth. 3. out 2. gnd 1. v cc n1.00 m 0.45 max n m c e c e l f f h g k ja b 3 2 1 d 2.30 0.55 max 14.00 0.50 0.45 0.85 1.27 1.00 0.45 3.70 max 4.80 max 4.70 max l k j h g f d c b a millimeters dim to-92 + _ 1 3 2 v cc out gnd + - equivalent circuit dim a b d e g h k 4.70 max 2.50 0.20 1.70 max 0.45+0.15/-0.10 4.25 max 1.50 0.10 0.40 typ 1.75 max 0.75 min 0.5+0.10/-0.05 sot-89 c j g d 123 2. gnd a c k j f millimeters h 1. v cc 3. out b e ff d + _ + _
1999. 11. 25 2/4 kia7419p/f~kia7445p/f revision no : 2 electrical characteristics maximum ratings (ta=25 ? ) characteristic symbol test cir. test condition min. typ. max. unit detecting voltage v s 1 r l =4.7k ? v oh " v ol -0.4 kia7419p/f kia7421p/f kia7423p/f kia7425p/f kia7427p/f kia7429p/f kia7431p/f kia7432p/f kia7433p/f kia7434p/f kia7435p/f kia7436p/f kia7439p/f kia7442p/f kia7445p/f 1.75 1.95 2.15 2.35 2.55 2.75 2.95 3.05 3.15 3.25 3.35 3.45 3.70 4.00 4.30 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.2 3.3 3.4 3.5 3.6 3.9 4.2 4.5 2.05 2.25 2.45 2.65 2.85 3.05 3.25 3.35 3.45 3.55 3.65 3.75 4.10 4.40 4.70 v low-level output voltage v ol 1 r l =4.7k ? v cc -0.4 -- v output leakage current i ol 1 v cc =7.5v - - 0.1  a hysterisis voltage vs 1 r l =4.7k ? kia7419p/f 20 50 100 mv kia7421p/f kia7423p/f 30 50 100 detecting voltage temperature coefficient vs/  t 1 r l =4.7k ? - ? 0.01 - %/ ? circuit current at on time icch 1 v cc =vsmin -0.05v - 300 500  a circuit current at off time iccl 1 v cc =5.25v kia7419p/f -3070  a kia7421p/f kia7423p/f -3050 threshold operating voltage vopr 1 r l =4.7k ? , v oh " v cc -0.4 - 0.8 - v "l" transmission delay time tphl 2 r l =4.7k ? , c l =100pf -10-  s "h" transmission delay time tplh 2 r l =4.7k ? , c l =100pf -10-  s output current i oh 1 v cc =vsmin -0.05v, r l =0 ? , tc=25 ? -2.0 -5.0 - ma characteristic symbol rating unit supply voltage v cc -0.3 q +7.5 v power dissipation (package limitation) kia7419p q 45p p d 400 mw kia7419p q 45f 500 operating temperature t opr -30 q +75 ? storage temperature t stg -55 q 150 ? type no. marking type no. marking kia7419f 4a kia7433f 4j kia7421f 4b kia7434f 4k kia7423f 4c kia7435f 4l kia7425f 4d kia7436f 4m kia7427f 4e kia7439f 4n kia7429f 4f kia7442f 4p kia7431f 4g kia7445f 4r kia7432f 4h marking
1999. 11. 25 3/4 kia7419p/f~kia7445p/f revision no : 2 v 3 2 1 v kia74xxp/f test circuit 1. c l a a l c test circuit 2. kia74xxp/f m 1 2 3 m dc ampere meter dc volt meter 0.2uf r l input pulse a is is v mis oscilloscope monitor
1999. 11. 25 4/4 kia7419p/f~kia7445p/f revision no : 2 precaution for use soldering flat package (sot-89 package) elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. (a) when employing solder reflow method y atmospheric temperature around resin surfaces must be less than 240 ? , not exceeding the time length of 10 sec. t recommend temperature profile ? precautions on heating method when resin in kept exposed to high temperature for a long time, device reliability may be marred. therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) when employing halogen lamps or infrared-ray heaters when halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces ; such devices cause extensive localized temperature rise. ? please keep a reflow solder operating when sot-89 package?s soldering. 60 sec. time (sec.) within 30 sec. within 10 sec. fi g 6 atomospheric temperature( c) =resin suface temperature 150 210 240


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